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SMKTOP > Press release list|April, 2012 ~ > Development of Smaller and Lighter Integral Molding Camera Module Sockets to Add to our Existing Lineup

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Development of Smaller and Lighter Integral Molding Camera Module Sockets to Add to our Existing Lineup

     
 We are pleased to announce the development and release of our "Integral Molding Camera Module Socket" to add to our existing product lineup. This product is aimed at smartphones, mobile phones and other mobile devices.
 Compared to existing assembly-type sockets, this series reduces the mounting area by approximately 20 to 30% and is more than 50% lighter. It ensures securer contact performance due to our unique contact and lock structure, contributing to improved equipment reliability.
 In addition to its compact and space-saving design, it supports automatic mounting by providing adsorption space.

 

【Profile of Integral molding camera module socket】

 

Drawing No.

 CLE9216-0301F

 CLE9214-0802F

 CLE9224-1101F

(Under Development)

External Appearance

 

 

Number of Pins

 16

 14

 24

Compliant Module Size

 8.5mm×8.5mm

 5.5mm×5.5mm

 6.5mm×6.5mm

 

 

 

Date Released 2013/03/18
Release No. 980cs
Product Name Integral Molding Camera Module Socket

Drawing No. CLE9216-0301F (FORM8.5)

                 CLE9214-0802F (FORM5.5)
                 CLE9224-1101F (FORM6.5)
Features

1) Uses a highly reliable contact and lock structure.
2) Ensures a secure module and socket ground connection.
3) Allows the mounting area to be reduced by approximately 20% (CLE9216-0301F) or 
  approximately 26% (CLE9224-1101F). (Compared to our existing products)
4) Secures greater mounting strength and is 53% lighter (CLE9216-0301F) and 50% lighter
  (CLE9224-1101F). (Compared to our existing products)
5) Its design focuses on shield properties.
6) RoHS compliant product.

Major Specifications

Voltage and Current Rating

AC/DC 50V 0.5A

Mounting Type SMT
Operating Temperature Range -30℃~+85℃
Applications Mobile phones, Smartphone, Digital camera, Other mobile equipment
Inquiry For more information, please contact the CS Division