Development and Release of the "FB Series" FPC to Board Connector for Batteries Enabling a Securer Connection Due to its Unique Contact Structure

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SMKTOP > Press release list｜April, 2012 ~ > Development and Release of the "FB Series" FPC to Board Connector for Batteries Enabling a Securer Connection Due to its Unique Contact Structure

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Development and Release of the "FB Series" FPC to Board Connector for Batteries Enabling a Securer Connection Due to its Unique Contact Structure

　　　　　
We are pleased to announce that we developed and released the high current-compatible "FB Series" FPC to board connector for smartphones, digital cameras, and other mobile devices.
Due to SMK's unique contact structure, this product enables a stable connection with battery packs, which demand high-reliability, helping to enhance equipment reliability. With a mating height of 0.9mm/0.95mm, it has a low-profile structure, contributing to equipment downsizing.
In addition to its compact and space-saving design, it supports automatic mounting by providing adsorption space.

Date Released	2013/02/06
Release No.	975cs
Product Name	"FB Series" FPC to Board Connector
	Drawing No.	CPB2504/2604-0101F (FB-2)
	Drawing No.	CPB9406/9506-0101F (FB-4)
Features	1) Due to SMK's unique contact structure, this product achieves a highly reliable, stable connection. 2) Equipped with a locking mechanism in the terminal and reinforcement terminal, it contributes to improved usability. 3) In addition to its compact and space-saving design, it supports automatic mounting by providing adsorption space. 4) Achieves a low profile with a mating height of 0.9mm/0.95mm. 5) Features a flux prevention mechanism. 6) RoHS compliant product.

Major Specifications	Voltage and Current Rating	AC/DC 30V 3.0A（Power pin） /1.0A(Signal pin)
	Contact Resistance	10mΩmax （FB-2） 20mΩmax （FB-4）
	Insulation Resistance	DC200V 1,000MΩmin
	Withstanding Voltage	AC500V（1 minute）
	Operating Temperature Range	-25℃～+85℃
Applications	Mobile phones, Smartphone, digital camera, other mobile equipment
Inquiry	For more information, please contact the CS Division

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