Development and Release of a "φ3.5 Earphone Jack (Curve Type)" for Smartphones and Compact/Thin Portable Devices
We are pleased to announce that we have developed and released a "φ3.5 Earphone Jack (Curve Type)" for smartphones and compact/thin portable devices.
The product uses a shape that is compatible with equipment with R-design housing (curve shape), enabling the custom design of jacks.
There have been increased demands for designability as well as compactness and thinness for mobile phones, digital audio players and other portable devices. Even in the case of earphone jacks, products that can respond flexibly to equipment design are sought after.
To respond to such demands, we have prepared two φ3.5 earphone jack models. The products’ circuits use a 4-pole sleeve make-switch system.
[Guide to φ3.5 Earphone Jack (Curve Type) Products]
①LGY2209-1101F: Designed to allow jacks be placed inside equipments' housing
by clearly establishing a place to fix the jack.
This enables the dual-use of parts between various kinds of equipment.
②LGY2109-XXXXF: Because it allows the front of the jack to be customized by exchanging (Series product) sleeve mold components, it contributes to reduced development costs and shortened development periods.
.
[Drawing Nos. and External Appearance of φ3.5 Earphone Jack (Curve Type)]
Drawing Nos. | LGY2209-1101F | LGY2109-XXXXF |
External appearance |
Date Released | Aug. 10th, 2011 | |
---|---|---|
Press Release No. | 931cs | |
Product Name | φ3.5 Earphone Jack (Curve Type) | |
Drawing Nos. LGY2209-1101F, LGY2109-XXXXF (series product) | ||
Features |
|
Major Specifications |
Voltage and Current Rating | AC/DC 12V 1A | |
---|---|---|---|
Contact Resistance | 1~100mA 30mΩ max. | ||
Insulating Resistance | DC500V 100MΩ min. | ||
Operating Temperatures | -40℃~+85℃ | ||
Operating Life | 5,000 times | ||
Applications | Smartphones, mobile phones, portable game machines, digital audio players, etc | ||
Production Capacity | 800,000 units per month | ||
Inquiry | * For more information, please contact the CS Division. |
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