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Mobile WiMax™ USB Dongle Technology developed

We are pleased to announce the development of Mobile WiMax USB Dongle, which attracts the attention as the next-generation radio communication, with the cooperation of Fujitsu Microelectronics Limited (Head Office: Shinjiku-ku, Tokyo, President: Haruki Okada).  

As the next-generation radio communication broadband technology, Mobile WiMax is capable of higher speed data communication than the current 3G mobile phones.  The Mobile WiMax™ has a superior communication quality compared to existing wireless LAN, and the development of new markets and services are expected. 

The prototype is being displayed at “CEATEC JAPAN”, the IT and Electronics Exhibition which starts from October 6, 2009. 

We are committed to commercializing this product through, for example, the expansion of business by further developments and marketing of various WiMax services. 


[Explanations of Terms]
WiMax: Worldwide Interoperability for Microwave Access
 A high-speed radio communication technology established by The Institute of Electrical and Engineers, Inc. (IEE). 

Dongle: a small equipment for connecting to computers. 


 


Date Released Oct. 08, 2009
Press Release No. 874rd 
Product Name Mobile WiMax™ USB Dongle
Features
  • 1) Equipped with Mobile WiMax™ chip set made by Fujitsu Microelectronics Limited (base-band LSI “MB86K23”, RF module “MB86K73”, power-source LSI “MB39C316”). 
  • 2) A high-speed mobile communication of 40Mbps max. is realized.
  • 3) A high-speed mobile communication is possible even while traveling. 
  • 4) Adopted the OFDMA to realize a state communication environment.
  • 5) Compatible with multi-bands (2.3G/2.5G/3.5GHz). 
Major specifications Carrier Frequency 2.3GHz band (2300-2400MHz),
2.5GHz band (2500-2700MHz),
3.5GHz (3400-3600MHz)
Band Width 10MHz
Transmission System OFDMA system
Maximum Output +23dBm
Applications Notebook PCs
Inquiry * For more information, please contact RD Division.
TEL: 81-3-3785-1438